ENCAPSULATING LAYER FOR PRINTHEAD ASSEMBLIES

    公开(公告)号:US20210008886A1

    公开(公告)日:2021-01-14

    申请号:US16604153

    申请日:2018-01-22

    IPC分类号: B41J2/165 B41J2/14

    摘要: The present disclosure is drawn to printhead assemblies including an encapsulating layer. For example, a printhead assembly can include a first printhead including a first array of dispensing nozzles and a second printhead including a second array of dispensing nozzles. The first and second array of dispensing nozzles can be positioned along an ejection surface of the printhead assembly. A removable cured encapsulating layer can be molded to conform to the ejection surface and fluidly seal the first array and