公开(公告)号：US20220143770A1

公开(公告)日：2022-05-12

申请号：US17298645

申请日：2019-07-26

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting WU ,  Qingyong GUO ,  Chi HAO

IPC: B23Q11/10 ,  C10M173/02

Abstract: The present disclosure is drawn to a cutting fluid for use in computer numerical control milling. The cutting fluid can include from about 10 wt % to about 90 wt % of a C2 to C6 alcohol; from about 0.1 wt % to about 20 wt % of a chelating agent; from about 0.5 wt % to about 15 wt % of a metal ion selected from aluminum ion, chromium ion, nickel ion, tin ion, zinc ion, or a combination thereof; and from about 8.5 wt % to about 88.5 wt % water. The cutting fluid can have a surface tension that can range from about 22 dynes/cm to about 55 dynes/cm.

公开(公告)号：US20240158943A1

公开(公告)日：2024-05-16

申请号：US18282661

申请日：2021-03-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Qingyong GUO ,  Ya-Ting YEH ,  Chi Hao CHANG ,  Kuan-Ting WU

IPC: C25D11/12 ,  C25D11/16 ,  C25D11/24

CPC classification number: C25D11/12 ,  C25D11/16 ,  C25D11/243 ,  C25D11/246

Abstract: The present disclosure is drawn to covers for electronic devices. In one example, a substrate can include a metal alloy. An acid anodizing layer can be formed on the substrate. A dye application can be applied on the acid anodizing layer. A first nickel-free sealing layer can be formed on the dye application. An alkaline anodizing layer can be formed on the first sealing layer. A second nickel-free sealing layer can be formed on the alkaline anodizing layer.