公开(公告)号：US20150227461A1

公开(公告)日：2015-08-13

申请号：US14425247

申请日：2012-10-31

Applicant: Hewlett-Packard Development Company, LP.

Inventor： Melvin K. Benedict ,  Eric L. Pope ,  Reza M. Bacchus ,  Guy E. McSwain ,  Joseph W. Fahy

IPC: G06F12/06

CPC classification number: G06F12/0646 ,  G06F2212/1032 ,  G11C29/70 ,  G11C2029/4402

Abstract: A technique includes during in-service use of a memory package in a computer system, using a first interface to access a defective address memory of the memory package. The defective address memory is accessible by a manufacturer of the memory package prior to the in-service use using a second interface of the memory package other than the first interface. In connection with the in-service use of the memory package, the memory package is repair, a repair that includes storing a defective address in the defective address memory to change an address mapping for at least one cell of the storage array.

Abstract translation: 一种技术包括在使用计算机系统中的存储器包的使用期间，使用第一接口来访问存储器包的缺陷地址存储器。 使用存储器包的第二接口而不是第一接口在使用之前，存储器包的制造商可以访问有缺陷的地址存储器。 关于存储器包的在役使用，存储器包是修复，修复包括将缺陷地址存储在缺陷地址存储器中，以改变存储阵列的至少一个单元的地址映射。