公开(公告)号：US11359047B2

公开(公告)日：2022-06-14

申请号：US16126612

申请日：2018-09-10

申请人： Hexion Inc.

发明人： Amitabh Bansal ,  Larry Steven Corley ,  Diana Sepulveda-Camarena ,  Jennifer W. Chung ,  Leeanne Taylor ,  Alla Hale

IPC分类号： C08G59/36 ,  C08G59/40 ,  C08G59/56 ,  C08G59/32 ,  C08G59/50 ,  C08G59/68

摘要： Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.