公开(公告)号：US06363976B1

公开(公告)日：2002-04-02

申请号：US09496412

申请日：2000-02-02

申请人： Hideji Aoki ,  Hidekazu Manabe ,  Katsuhito Kamachi

发明人： Hideji Aoki ,  Hidekazu Manabe ,  Katsuhito Kamachi

IPC分类号： B21F100

CPC分类号： H01L21/4842

摘要： A semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device are provided. A horizontal driver (111) and a vertical driver (112) are controlled to move a punch holder (110), or an end portion (101T1) of a punch (101), within a plane defined by first and second directions (D1, D2). A tip (101A) of the punch (101) is brought into contact with leads (11), with a punch-side forming surface (101S) and a die-side forming surface (151S) maintained in parallel relationship. A pressurizer (131) is controlled to move the end portion (101T1) in a fourth direction (D4) toward the die-side forming surface (151S), and the punch-side forming surface (101S) and the die-side forming surface (151S) hold the leads (11) therebetween. A pressure detector (121) detects a load placed upon the punch (101). A controller (190) receives a detection signal (S121) from the pressure detector (121) and controls the pressurizer (131) to place a predetermined load upon the lead (11) held between the punch-side forming surface (101S) and the die-side forming surface (151S). The semiconductor manufacturing apparatus is capable of accurately forming the leads of the semiconductor device without damages to the leads.

摘要翻译： 提供半导体制造装置和半导体装置的制造方法。 控制水平驱动器（111）和垂直驱动器（112），以在由第一和第二方向（D1，D2）限定的平面内移动冲头保持器（110）或冲头（101）的端部（101T1） D2）。 冲头（101）的尖端（101A）与引线（11）接触，冲头侧形成表面（101S）和冲模侧形成表面（151S）保持平行关系。 控制加压器（131）使端部（101T1）向第四方向（D4）朝向模侧形成面（151S）移动，冲头侧形成面（101S）和模侧形成面 （151S）在其间保持引线（11）。 压力检测器（121）检测放置在冲头（101）上的负载。 控制器（190）从压力检测器（121）接收检测信号（S121），并控制加压器（131）将预定负荷放置在保持在冲压侧形成表面（101S）和 模侧形成面（151S）。 半导体制造装置能够精确地形成半导体器件的引线而不损害引线。