公开(公告)号：US20210107750A1

公开(公告)日：2021-04-15

申请号：US16756469

申请日：2018-11-06

申请人： Hideki IINO ,  Kiyoshi AOKI ,  Hayato HORIKOSHI

发明人： Hideki IINO ,  Kiyoshi AOKI ,  Hayato HORIKOSHI

IPC分类号： B65G61/00 ,  B25J9/16

摘要： The present invention is provided to achieve smooth devanning or depalletizing of rectangular packages while managing various situations. Package identification codes 10a, 10b, 10c, 10d are displayed at a predetermined position of each of four surfaces of front, back, left and right or on each of all surfaces of a package 5A having a rectangular shape, and code data-of the identification codes is identified by a predetermined controller via a reading unit. The code data includes size information of a height size and a width size of a code display surface of the package 5A. The controller of a robot having the reading unit and a robot hand is configured to position the robot hand with the package 5A based on a code display position and the size information.