公开(公告)号：US20080254720A1

公开(公告)日：2008-10-16

申请号：US11884833

申请日：2006-03-01

申请人： Hiromasa Hashimoto ,  Yasuharu Ariga ,  Hisashi Masumura ,  Kouzi Kitagawa ,  Toshimasa Kubota ,  Takahiro Matsuda

发明人： Hiromasa Hashimoto ,  Yasuharu Ariga ,  Hisashi Masumura ,  Kouzi Kitagawa ,  Toshimasa Kubota ,  Takahiro Matsuda

IPC分类号： B24B29/00 ,  B24B9/00 ,  H01L21/302

CPC分类号： B24B37/30

摘要： The present invention provides a polishing head 1 comprising a carrier 3, a guide ring 4, a dress ring 5, and a head body 2, wherein the head body 2 is rotatable, and holds the carrier 3, the guide ring 4, and the dress ring 5; the head body 2 has a reversed-bowl shape and has a hollow 8; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm 6; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanism 9 communicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing pad 11 on a turn table 12 with rotating the wafer held by the carrier and the dress ring. Consequently, there is provided a polishing head or the like with which excessive polishing in the outer periphery of a semiconductor wafer can be prevented and generation of impressions or scratches in the edge portion of the wafer can be prevented effectively.

摘要翻译： 本发明提供了一种抛光头1，其包括载体3，导向环4，连接环5和头部主体2，其中头部主体2可旋转，并且保持载体3，导向环4和 连衣裙5; 头体2具有倒碗形状并具有中空部8; 连接环，并且至少导向环或载体通过隔膜6联接到头本体的下边缘; 头体的中空被密封。 在抛光期间，通过与中空部连通的压力调节机构9来调节密封空心的压力，从而使隔膜弹性变形。 结果，晶片W可以被抛光，同时通过旋转由载体和连接环保持的晶片，在给定的压力下对转台12上的抛光垫11施加压力。 因此，提供了可以防止在半导体晶片的外周中进行过度抛光并且可以有效地防止在晶片的边缘部分产生印模或划痕的抛光头等。

公开(公告)号：US07740521B2

公开(公告)日：2010-06-22

申请号：US11884833

申请日：2006-03-01

申请人： Hiromasa Hashimoto ,  Yasuharu Ariga ,  Hisashi Masumura ,  Kouzi Kitagawa ,  Toshimasa Kubota ,  Takahiro Matsuda

发明人： Hiromasa Hashimoto ,  Yasuharu Ariga ,  Hisashi Masumura ,  Kouzi Kitagawa ,  Toshimasa Kubota ,  Takahiro Matsuda

IPC分类号： B24B1/00 ,  B24B21/18

CPC分类号： B24B37/30

摘要： The present invention provides a polishing head 1 comprising a carrier 3, a guide ring 4, a dress ring 5, and a head body 2, wherein the head body 2 is rotatable, and holds the carrier 3, the guide ring 4, and the dress ring 5; the head body 2 has a reversed-bowl shape and has a hollow 8; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm 6; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanism 9 communicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing pad 11 on a turn table 12 with rotating the wafer held by the carrier and the dress ring. Consequently, there is provided a polishing head or the like with which excessive polishing in the outer periphery of a semiconductor wafer can be prevented and generation of impressions or scratches in the edge portion of the wafer can be prevented effectively.

摘要翻译： 本发明提供了一种抛光头1，其包括载体3，导向环4，连接环5和头部主体2，其中头部主体2可旋转，并且保持载体3，导向环4和 连衣裙5; 头体2具有倒碗形状并具有中空部8; 连接环，并且至少导向环或载体通过隔膜6联接到头本体的下边缘; 头体的中空被密封。 在抛光期间，通过与中空部连通的压力调节机构9来调节密封空心的压力，从而使隔膜弹性变形。 结果，晶片W可以被抛光，同时通过旋转由载体和连接环保持的晶片，在给定的压力下对转台12上的抛光垫11施加压力。 因此，提供了可以防止在半导体晶片的外周中进行过度抛光并且可以有效地防止在晶片的边缘部分产生印模或划痕的抛光头等。