公开(公告)号：US08685169B2

公开(公告)日：2014-04-01

申请号：US12952804

申请日：2010-11-23

申请人： Hironobu Hyakutake ,  Toshihide Takashima

发明人： Hironobu Hyakutake ,  Toshihide Takashima

IPC分类号： C23G1/02 ,  B08B3/04

CPC分类号： H01L21/67057 ,  H01L21/67253

摘要： Disclosed are a substrate processing apparatus, a substrate processing method and a storage medium, capable of removing contaminant materials from a substrate by using SPM liquid (sulfuric acid and hydrogen peroxide mixture) while preventing degradation of the function of the SPM liquid for removing the contaminant materials. The SPM liquid is filled in a processing bath and the substrate is immersed in the SPM liquid. A heating unit is provided in the circulation path to heat the SPM liquid. A hydrogen peroxide supply line supplements hydrogen peroxide to the SPM liquid in the circulation path. A control unit adjusts the temperature of the SPM liquid to the predetermined temperature in the range of 135° C. to 170° C. based on a temperature detection value and outputs a control signal to supplement the sulfuric acid to compensate for the SPM liquid as the SPM liquid is evaporated by heating.

摘要翻译： 公开了一种基板处理装置，基板处理方法和存储介质，其能够通过使用SPM液体（硫酸和过氧化氢混合物）从基板除去污染物质，同时防止用于除去污染物的SPM液体的功能降低 材料 将SPM液体填充在处理槽中，将基板浸渍在SPM液体中。 在循环路径中设置加热单元以加热SPM液体。 过氧化氢供应线补充过氧化氢到循环路径中的SPM液体。 控制单元根据温度检测值将SPM液体的温度调节到135℃至170℃范围内的预定温度，并输出控制信号以补充硫酸以补偿SPM液体 通过加热蒸发SPM液体。