公开(公告)号：US20070259609A1

公开(公告)日：2007-11-08

申请号：US10599429

申请日：2005-03-29

申请人： Hiroshi Iiyoshi ,  Takashi Kimura ,  Tuguhisa Koyama ,  Hiroaki Iizuka

发明人： Hiroshi Iiyoshi ,  Takashi Kimura ,  Tuguhisa Koyama ,  Hiroaki Iizuka

IPC分类号： B24B53/00

CPC分类号： B24B53/12 ,  B24B53/017

摘要： In a CMP conditioner in which abrasive grains are fixed to a protrusion protruded from an upper surface of a base, the abrasive grains are stably fixed to prevent a scratch from being generated due to detachment of the abrasive grains and a space for holding a polishing fluid is surely ensured between a protrusion section of the protrusion surrounding the abrasive grains and the pad upon dressing. In the CMP conditioner in which protrusions are protruded from an upper surface of a base which rotates around an axis line and a plurality of abrasive grains is fixed to the protrusions, the abrasive grains are fixed such that the abrasive grains are not protruded from a virtual extending surface which extends from the peripheries of protrusion sections, which face protrusion directions of the protrusions, along the axis line.

摘要翻译： 在将磨粒固定到从基体的上表面突出的突起的CMP调节剂中，磨粒稳定地固定，以防止由于磨粒的剥离而产生刮伤，并且保持研磨液的空间 确保在包围磨料颗粒的突起的突起部分与敷料之间的垫片之间确保。 在从旋转轴线的基部的上表面突出突出的CMP调节器中，将多个磨粒固定在突起上，磨粒被固定，使得磨粒不会从虚拟的 延伸表面，其从突出部的突出方向的周边沿着轴线延伸。