公开(公告)号：US20080032559A1

公开(公告)日：2008-02-07

申请号：US11785009

申请日：2007-04-13

申请人： Hiroyuki Fujita ,  Hiroto Mochizuki

发明人： Hiroyuki Fujita ,  Hiroto Mochizuki

IPC分类号： H01R24/00

CPC分类号： H01R12/57

摘要： A microconnector in which elastic contact force is improved and a manufacturing method of a socket therefore, are provided.The microconnector includes:the socket 10 in which plural cantilever terminal blocks 14 having pressure receiving parts 16 are integrally formed on a board 11 made of single crystal silicon, and socket leads 15 are disposed on the terminal blocks 14; anda plug 20 in which plug leads 21 corresponding to the socket leads 15 are provided on a plug board 23. The manufacturing method of the socket 10 includes:a step of applying a resist to one surface of the board 11;a step of patterning the terminal blocks 14 by photolithography;a step of performing anisotropic etching to form the terminal blocks 14 to predetermined heights while a bottom is made to remain;a step of applying a resist to the other surface of the board 11; a step of patterning the pressure receiving parts 16 by photolithography; anda step of performing isotropic etching to remove the bottom.

摘要翻译： 提供了弹性接触力提高的微型连接器及其插座的制造方法。 微型连接器包括：插座10，其中具有受压部分16的多个悬臂端子块14一体地形成在由单晶硅制成的板11上，并且插座引线15设置在端子块14上; 并且在插头板23上设置有与插座引线15对应的插头引线21的插头20。插座10的制造方法包括：将抗蚀剂涂布在基板11的一个面上的工序; 通过光刻对端子块14进行构图的步骤; 在保持底部的同时进行各向异性蚀刻以形成端子块14至预定高度的步骤; 将抗蚀剂施加到板11的另一个表面的步骤; 通过光刻对压力接收部16进行图案化的步骤; 以及进行各向同性蚀刻以去除底部的步骤。

公开(公告)号：US20060057895A1

公开(公告)日：2006-03-16

申请号：US10541237

申请日：2004-01-26

申请人： Hiroyuki Fujita ,  Hiroto Mochizuki

发明人： Hiroyuki Fujita ,  Hiroto Mochizuki

IPC分类号： H01R24/00

CPC分类号： H01R12/57

摘要： A microconnector in which elastic contact force is improved and a manufacturing method of a socket therefore, are provided. The microconnector includes: the socket 10 in which plural cantilever terminal blocks 14 having pressure receiving parts 16 are integrally formed on a board 11 made of single crystal silicon, and socket leads 15 are disposed on the terminal blocks 14; and a plug 20 in which plug leads 21 corresponding to the socket leads 15 are provided on a plug board 23. The manufacturing method of the socket 10 includes: a step of applying a resist to one surface of the board 11; a step of patterning the terminal blocks 14 by photolithography; a step of performing anisotropic etching to form the terminal blocks 14 to predetermined heights while a bottom is made to remain; a step of applying a resist to the other surface of the board 11; a step of patterning the pressure receiving parts 16 by photolithography; and a step of performing isotropic etching to remove the bottom.

摘要翻译： 提供了弹性接触力提高的微型连接器及其插座的制造方法。 微型连接器包括

公开(公告)号：US07220147B2

公开(公告)日：2007-05-22

申请号：US10541237

申请日：2004-01-26

申请人： Hiroyuki Fujita ,  Hiroto Mochizuki

发明人： Hiroyuki Fujita ,  Hiroto Mochizuki

IPC分类号： H01R24/00

CPC分类号： H01R12/57

摘要： A microconnector in which elastic contact force is improved and a manufacturing method of a socket therefore, are provided.The microconnector includes: the socket 10 in which plural cantilever terminal blocks 14 having pressure receiving parts 16 are integrally formed on a board 11 made of single crystal silicon, and socket leads 15 are disposed on the terminal blocks 14; and a plug 20 in which plug leads 21 corresponding to the socket leads 15 are provided on a plug board 23. The manufacturing method of the socket 10 includes: a step of applying a resist to one surface of the board 11; a step of patterning the terminal blocks 14 by photolithography; a step of performing anisotropic etching to form the terminal blocks 14 to predetermined heights while a bottom is made to remain; a step of applying a resist to the other surface of the board 11; a step of patterning the pressure receiving parts 16 by photolithography; and a step of performing isotropic etching to remove the bottom.

摘要翻译： 提供了弹性接触力提高的微型连接器及其插座的制造方法。 微型连接器包括：插座10，其中具有受压部分16的多个悬臂端子块14一体地形成在由单晶硅制成的板11上，并且插座引线15设置在端子块14上; 并且在插头板23上设置有与插座引线15对应的插头引线21的插头20。插座10的制造方法包括：将抗蚀剂涂布在基板11的一个面上的工序; 通过光刻对端子块14进行构图的步骤; 在保持底部的同时进行各向异性蚀刻以形成端子块14至预定高度的步骤; 将抗蚀剂施加到板11的另一个表面的步骤; 通过光刻对压力接收部16进行图案化的步骤; 以及进行各向同性蚀刻以去除底部的步骤。