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公开(公告)号:US06388879B1
公开(公告)日:2002-05-14
申请号:US08387046
申请日:1995-02-09
申请人: Hiroyuki Otaguro , Takayuki Ashida , Hitoshi Yokemura , Hidenao Nakajima , Yoshimi Watanabe , Shuuhei Fujita
发明人: Hiroyuki Otaguro , Takayuki Ashida , Hitoshi Yokemura , Hidenao Nakajima , Yoshimi Watanabe , Shuuhei Fujita
IPC分类号: H05K720
CPC分类号: H05K7/1458 , G02B6/43
摘要: A circuit board packaging structure comprises a plurality of circuit boards disposed in parallel to each other and each packaged with electric circuit parts. The circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on the other circuit boards is disposed outermost among the plurality of circuit boards. The surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside the structure.
摘要翻译: 一种电路板封装结构,包括彼此并联设置的多个电路板,并且每个电路板与电路部件一起封装。 与多个电路基板中包含的电路部件相比,具有比放电量大的电路部件的电路板设置在多个电路基板的最外侧。 填充有显示较大放热量的电路部件的电路板的表面指向结构外部。
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公开(公告)号:US06572409B2
公开(公告)日:2003-06-03
申请号:US10027151
申请日:2001-12-20
申请人: Kunihiro Nitta , Shuuhei Fujita , Hidenao Nakajima
发明人: Kunihiro Nitta , Shuuhei Fujita , Hidenao Nakajima
IPC分类号: H01R13648
CPC分类号: H01R13/6585 , H01R12/724 , H01R31/06
摘要: A connector element has a plurality of contacts (23) arranged in first and second directions (A1, A2) perpendicular to each other on a predetermined plane to form a matrix. A plurality of ground members (25) extend substantially in parallel to one another in an oblique direction inclined with respect to the first and the second direction on the predetermined plane. At least one of the contacts is positioned between adjacent ones of the ground members.
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