Circuit board packaging structure
    1.
    发明授权
    Circuit board packaging structure 失效
    电路板封装结构

    公开(公告)号:US06388879B1

    公开(公告)日:2002-05-14

    申请号:US08387046

    申请日:1995-02-09

    IPC分类号: H05K720

    CPC分类号: H05K7/1458 G02B6/43

    摘要: A circuit board packaging structure comprises a plurality of circuit boards disposed in parallel to each other and each packaged with electric circuit parts. The circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on the other circuit boards is disposed outermost among the plurality of circuit boards. The surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside the structure.

    摘要翻译: 一种电路板封装结构,包括彼此并联设置的多个电路板,并且每个电路板与电路部件一起封装。 与多个电路基板中包含的电路部件相比,具有比放电量大的电路部件的电路板设置在多个电路基板的最外侧。 填充有显示较大放热量的电路部件的电路板的表面指向结构外部。