公开(公告)号：US20010020194A1

公开(公告)日：2001-09-06

申请号：US09812822

申请日：2001-03-21

Applicant: Hitachi, Ltd.

Inventor： Yuji Takagi ,  Hideaki Doi ,  Makoto Ono

IPC: G05B013/02 ,  G06F019/00 ,  G01N037/00

CPC classification number: G01N21/94

Abstract: The present invention relates to a method of inspecting a product, comprising extracting defects from the product, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects for inspection; and to an inspection system comprising an inspecting means for extracting defects from the product, a defect classifying means for classifying the defects on the basis of information about the defects extracted by the inspecting means representing the analogy of the defects, and a feature data extracting means for extracting the feature data of the defects on the basis of the result of defect classification provided by the defect classifying means, characterized in that the feature data of the defects extracted by the feature data extracting means is fed back to the inspecting means for inspecting the product. The present invention relates also to a method of manufacturing a semiconductor device or the like, comprising extracting defects from the semiconductor device or the like, classifying the defects on the basis of information about the extracted defects representing the analogy of the defects, extracting the feature data of the defects on the basis of the result of defect classification, and feeding back the feature data of the extracted defects to an apparatus for manufacturing the semiconductor device or the like.

Abstract translation: 本发明涉及一种检查产品的方法，包括从产品中提取缺陷，基于关于代表缺陷类似物的提取缺陷的信息对缺陷进行分类，基于该缺陷提取缺陷的特征数据 缺陷分类结果，反馈提取缺陷的特征数据进行检查; 以及包括用于从产品中提取缺陷的检查装置的检查系统，用于根据由表示类似于缺陷的检查装置提取的缺陷的信息来分类缺陷的缺陷分类装置，以及特征数据提取装置 用于基于由缺陷分类装置提供的缺陷分类的结果来提取缺陷的特征数据，其特征在于，将由特征数据提取装置提取的缺陷的特征数据反馈到检查装置，以检查 产品。 本发明还涉及一种制造半导体器件等的方法，包括从半导体器件等中提取缺陷，基于关于表示类似于缺陷的提取缺陷的信息来分类缺陷，提取特征 基于缺陷分类的结果的缺陷的数据，并将提取的缺陷的特征数据反馈到用于制造半导体器件等的装置。