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公开(公告)号：US20200294220A1
公开(公告)日：2020-09-17
申请号：US16355419
申请日：2019-03-15
Applicant: Hitachi, Ltd.
Inventor： Maria Teresa GONZALEZ DIAZ , Dipanjan GHOSH , Adriano ARANTES , Michiko YOSHIDA , Jiro HASHIZUME , Chetan GUPTA , Phawis THAMMASORN
Abstract: Example implementations described herein involve defect analysis for images received from a camera system, which can involve applying a first model configured to determine regions of interest of the object from the images, applying a second model configured to identify localized areas of the object based on the regions of interest on the images; and applying a third model configured to identify defects in the localized ones of the images.
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