公开(公告)号：US20120189961A1

公开(公告)日：2012-07-26

申请号：US13353066

申请日：2012-01-18

申请人： Ho Chan JI ,  Sunghyun KIM ,  Dongchang CHOI ,  Kyung Soo CHOI ,  Geun Young CHA ,  Sang Chul LEE

发明人： Ho Chan JI ,  Sunghyun KIM ,  Dongchang CHOI ,  Kyung Soo CHOI ,  Geun Young CHA ,  Sang Chul LEE

IPC分类号： G03F7/20 ,  G03F7/032

CPC分类号： G03F7/0007 ,  G03F7/0048 ,  G03F7/027 ,  G03F7/032

摘要： The present invention relates to a photosensitive resin composition and a photosensitive material comprising the same. The photosensitive resin composition according to an exemplary embodiment of the present invention may comprise two multi-functional monomers where structures of side chains comprising unsaturated double bonds are different from each other while a composition ratio is changed. Accordingly, in the exemplary embodiment of the present invention, processability is excellent, and it is possible to decrease defects by a rupture when a LCD substrate is sealed and substrate separation defects due to an impact to the LCD products by improving an adhesion property to a lower substrate after a hard baking process.

摘要翻译： 本发明涉及感光性树脂组合物及含有该感光性树脂组合物的感光性物质。 根据本发明的示例性实施方案的感光性树脂组合物可以包含两种多官能单体，其中包含不饱和双键的侧链的结构在组成比改变的同时彼此不同。 因此，在本发明的示例性实施例中，加工性优异，并且可以通过在LCD基板被密封时由于破裂而导致的缺陷以及由于通过改善对LCD产品的粘附性而对LCD产品的冲击造成的基板分离缺陷 经过硬烘焙处理后的下基板。