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公开(公告)号：US10605820B2
公开(公告)日：2020-03-31
申请号：US15793571
申请日：2017-10-25
Applicant: Honeywell International Inc.
Inventor： Petr Cvach , Tomas Neuzil , Jan Scheirich
IPC: G01P1/02 , F16F15/02 , G01D11/10 , B81B7/00 , G01D11/24 , G01P1/00 , F16F15/08 , G01C21/16 , H05K7/14 , H05K7/20 , H05K5/00
Abstract: A shock-isolated mounting device and a method and system are provided. For example, the shock-isolated mounting device includes an enclosure configured to support the mounting device, at least one damper attached between the mounting device and the enclosure, and a thermally-conductive element disposed on a surface of the mounting device and configured to thermally couple the mounting device to the enclosure. The thermally-conductive element facilitates the dissipation of heat generated by electronic components mounted onto the shock-isolated mounting device.
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公开(公告)号：US20190120870A1
公开(公告)日：2019-04-25
申请号：US15793571
申请日：2017-10-25
Applicant: Honeywell International Inc.
Inventor： Petr Cvach , Tomas Neuzil , Jan Scheirich
Abstract: A shock-isolated mounting device and a method and system are provided. For example, the shock-isolated mounting device includes an enclosure configured to support the mounting device, at least one damper attached between the mounting device and the enclosure, and a thermally-conductive element disposed on a surface of the mounting device and configured to thermally couple the mounting device to the enclosure. The thermally-conductive element facilitates the dissipation of heat generated by electronic components mounted onto the shock-isolated mounting device.
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