公开(公告)号：US20110097856A1

公开(公告)日：2011-04-28

申请号：US12632611

申请日：2009-12-07

申请人： Hong Won KIM ,  Joon Seok Kang ,  Doo Sung Jung ,  Seon Hee Moon

发明人： Hong Won KIM ,  Joon Seok Kang ,  Doo Sung Jung ,  Seon Hee Moon

IPC分类号： H01L21/56

CPC分类号： H01L23/562 ,  H01L21/568 ,  H01L23/3171 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00

摘要： Disclosed is a method of manufacturing a wafer level package, which includes arranging semiconductor dies on a carrier, forming a protective layer between the semiconductor dies of the carrier through screen printing, primarily heat hardening the protective layer, simultaneously pressing and secondarily heat hardening the protective layer, and removing the carrier, so that a thickness difference between the semiconductor dies and the protective layer is not formed and the warping of the wafer level package is reduced.

摘要翻译： 公开了一种制造晶片级封装的方法，其包括在载体上布置半导体管芯，通过丝网印刷在载体的半导体管芯之间形成保护层，主要将保护层加热硬化，同时加压硬化保护层 层，并且移除载体，使得半导体管芯和保护层之间的厚度差不会形成，并且晶片级封装的翘曲减小。