Complementary metal oxide semiconductor device having metal gate stack structure and method of manufacturing the same
    1.
    发明授权
    Complementary metal oxide semiconductor device having metal gate stack structure and method of manufacturing the same 有权
    具有金属栅叠层结构的互补金属氧化物半导体器件及其制造方法

    公开(公告)号:US08513740B2

    公开(公告)日:2013-08-20

    申请号:US12873611

    申请日:2010-09-01

    IPC分类号: H01L27/092

    摘要: A complementary metal oxide semiconductor (CMOS) device including: a semiconductor substrate including a NMOS region and a PMOS region; a NMOS metal gate stack structure on the NMOS region and including a first high dielectric layer, a first barrier metal gate on the first high dielectric layer and including a metal oxide nitride layer, and a first metal gate on the first barrier metal gate; and a PMOS metal gate stack structure on the PMOS region and including a second high dielectric layer, a second barrier metal gate on the second high dielectric layer and including a metal oxide nitride layer, and a second metal gate on the second barrier metal gate.

    摘要翻译: 一种互补金属氧化物半导体(CMOS)器件,包括:包括NMOS区域和PMOS区域的半导体衬底; 在NMOS区域上的NMOS金属栅叠层结构,包括第一高介电层,第一高电介质层上的第一势垒金属栅极,并且包括金属氧化物氮化物层,以及第一栅极金属栅极上的第一金属栅极; 以及在PMOS区域上的PMOS金属栅极堆叠结构,并且包括第二高介电层,第二高介电层上的第二阻挡金属栅极,并且包括金属氧化物氮化物层,以及在第二阻挡金属栅极上的第二金属栅极。

    COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DEVICE HAVING METAL GATE STACK STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DEVICE HAVING METAL GATE STACK STRUCTURE AND METHOD OF MANUFACTURING THE SAME 有权
    具有金属栅格堆叠结构的补充金属氧化物半导体器件及其制造方法

    公开(公告)号:US20110121399A1

    公开(公告)日:2011-05-26

    申请号:US12873611

    申请日:2010-09-01

    IPC分类号: H01L27/092

    摘要: A complementary metal oxide semiconductor (CMOS) device including: a semiconductor substrate including a NMOS region and a PMOS region; a NMOS metal gate stack structure on the NMOS region and including a first high dielectric layer, a first barrier metal gate on the first high dielectric layer and including a metal oxide nitride layer, and a first metal gate on the first barrier metal gate; and a PMOS metal gate stack structure on the PMOS region and including a second high dielectric layer, a second barrier metal gate on the second high dielectric layer and including a metal oxide nitride layer, and a second metal gate on the second barrier metal gate.

    摘要翻译: 一种互补金属氧化物半导体(CMOS)器件,包括:包括NMOS区域和PMOS区域的半导体衬底; 在NMOS区域上的NMOS金属栅叠层结构,包括第一高介电层,第一高电介质层上的第一势垒金属栅极,并且包括金属氧化物氮化物层,以及第一栅极金属栅极上的第一金属栅极; 以及在PMOS区域上的PMOS金属栅极堆叠结构,并且包括第二高介电层,第二高介电层上的第二阻挡金属栅极,并且包括金属氧化物氮化物层,以及在第二阻挡金属栅极上的第二金属栅极。