公开(公告)号：US20220104398A1

公开(公告)日：2022-03-31

申请号：US17426359

申请日：2020-11-16

Applicant: Honor Device Co., Ltd.

Inventor： Yameng WEI ,  Xianliang LIU ,  Guangkun CHENG

IPC: H05K7/20

Abstract: A heat pipe, a heat dissipation module, and a terminal device are disclosed. The heat pipe includes a heat pipe body and an ineffective portion that is integrally formed with the heat pipe body when the heat pipe is manufactured, where an inner side of a pipe wall of the heat pipe body has a porous capillary structure layer, the ineffective portion is located in at least a part of the periphery of the heat pipe body, and the ineffective portion is used as a mounting portion for fastening the heat pipe to another object. In a mounting process, a pressure needs to be applied only to the ineffective portion, so that the heat pipe body is not obviously affected. In this way, integrity of the porous capillary structure layer inside the heat pipe body is ensured while the heat pipe is fastened.