公开(公告)号：US20240340366A1

公开(公告)日：2024-10-10

申请号：US18700041

申请日：2023-08-24

Applicant: Honor Device Co., Ltd.

Inventor： Honglin Cheng ,  Zhixiang Huang ,  Yangjie Tang ,  Hongbin Yang ,  Yang Liu

IPC: H04M1/02 ,  H01R4/48

CPC classification number: H04M1/0264 ,  H01R4/48

Abstract: A grounding spring and an electronic device. The grounding spring is applied to an electronic device. The electronic device includes a camera assembly, a camera bracket configured to mount the camera assembly, and a main board. The main board has a grounding area. The grounding spring includes a body part and a grounding part. The grounding part is located on one side of the body part and is fixedly connected to the body part. A side that is of the body part and that is away from the grounding part is bent in a direction close to the grounding part to form a first bending part, and a side that is of the first bending part and that is close to the grounding part is bent in a direction away from the grounding part to form a second bending part.