公开(公告)号：US20240130177A1

公开(公告)日：2024-04-18

申请号：US18007854

申请日：2022-09-09

Applicant: Honor Device Co., Ltd.

Inventor： Yabin An ,  Wei Qu ,  Feng Zhang

IPC: H10K59/131 ,  G02F1/1345 ,  H10K59/12 ,  H10K59/124

CPC classification number: H10K59/131 ,  G02F1/13452 ,  H10K59/1201 ,  H10K59/124

Abstract: Embodiments of this application provide a display panel and a manufacturing method thereof, and a terminal device, which are applied to the field of terminal technologies. The display panel includes a rigid substrate, a driving circuit layer arranged on the rigid substrate, and a first organic layer structure, a conductive layer and a second organic layer structure that are sequentially arranged away from the rigid substrate, where the rigid substrate and the driving circuit layer are arranged bypassing a bendable region, and first organic layer structure, the conductive layer, and the second organic layer structure are distributed in at least a first peripheral region, the bendable region, and a binding region. The rigid substrate and the driving circuit layer in the bendable region are peeled off, so that the display panel in the bendable region can be bent, and the display panel in the binding region can be bent to the backlight side of the display panel, thereby reducing a width of a bezel on a side where the binding region of the display panel is located. In addition, by arranging the first organic layer structure, the conductive layer, and the second organic layer structure, rigidity of the display panel in the bendable region can be enhanced, thereby maintaining a bending profile in the bendable region.

公开(公告)号：US12193293B2

公开(公告)日：2025-01-07

申请号：US18007854

申请日：2022-09-09

Applicant: Honor Device Co., Ltd.

Inventor： Yabin An ,  Wei Qu ,  Feng Zhang

IPC: H10K59/131 ,  G02F1/1345 ,  H10K59/12 ,  H10K59/124

Abstract: Embodiments of this application provide a display panel and a manufacturing method thereof, and a terminal device, which are applied to the field of terminal technologies. The display panel includes a rigid substrate, a driving circuit layer arranged on the rigid substrate, and a first organic layer structure, a conductive layer, and a second organic layer structure that are sequentially arranged away from the rigid substrate, where the rigid substrate and the driving circuit layer are arranged bypassing a bendable region, and first organic layer structure, the conductive layer, and the second organic layer structure are distributed in at least a first peripheral region, the bendable region, and a binding region.