公开(公告)号：US06319754B1

公开(公告)日：2001-11-20

申请号：US09613553

申请日：2000-07-10

Applicant: How-Shin Wang ,  Chun-Hung Lin

Inventor： How-Shin Wang ,  Chun-Hung Lin

IPC: H01L2150

CPC classification number: H01L21/6835 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68322 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/07802

Abstract: A wafer-dicing process includes the steps of attaching the wafer to a wafer mounting sheet which includes a bonding adhesive layer, a releasable film layer, a resilient substrate layer, and a light-curable adhesive layer, laying assembly of the wafer and the wafer mounting sheet on a wafer carrier sheet, exposing assembly of the wafer, the wafer mounting sheet and the wafer carrier sheet to cure the light-curable adhesive layer, cutting the wafer to form bare dice, sucking one of the dice and pushing upwardly the carrier sheet, and moving and mounting the die to a die mounting substrate.

Abstract translation: 晶片切割工艺包括以下步骤：将晶片连接到晶片安装片上，该晶片安装片包括粘合粘合剂层，可剥离膜层，弹性基底层和可光固化粘合剂层，晶片和晶片的铺设组件 安装片在晶片载体片上，暴露晶片，晶片安装片和晶片载体片的组件以固化可光固化粘合剂层，切割晶片以形成裸裸片，吸取骰子中的一个并向上推动载体 片，并将模具移动并安装到管芯安装基板。