公开(公告)号：US20130078076A1

公开(公告)日：2013-03-28

申请号：US13308498

申请日：2011-11-30

申请人： Hsin Hsiung ,  Ching-Feng Hsieh

发明人： Hsin Hsiung ,  Ching-Feng Hsieh

IPC分类号： B65G47/92 ,  H01F1/00

CPC分类号： H01F7/0257 ,  H01F7/206 ,  H01L21/67709

摘要： A method transfers substrate modules that are formed by cutting a substrate sheet in a cutting machine. The method rapidly and efficiently transfers the substrate modules from the cutting machine to facilitate the transfer of the substrate modules for subsequent processes, thereby reducing operational time and complexity, reducing machine idle time, and increasing operational efficiency, to avoid requiring additional equipment for operation and thus increasing yield as a result.

摘要翻译： 一种方法传送通过在切割机中切割基板而形成的基板模块。 该方法快速有效地从切割机传送基板模块，以方便后续处理的基板模块的传送，从而减少操作时间和复杂性，减少机器空闲时间并提高运行效率，以避免需要额外的设备进行操作， 从而提高产量。