公开(公告)号：US20250079269A1

公开(公告)日：2025-03-06

申请号：US18820690

申请日：2024-08-30

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yumin LIU ,  Bo YUAN ,  Yue CHEN ,  Yafei LV

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31

Abstract: A power module, including: a chip, a package baseplate, a ceramic baseplate, and a plastic package body. The chip is disposed on the ceramic baseplate, the package baseplate is disposed on a surface that is of the ceramic baseplate and that is away from the chip, and an area of the package baseplate is greater than an area of the ceramic baseplate. The package baseplate includes at least one protrusion structure which is located on a surface that is of the package baseplate and that is close to the ceramic baseplate, and projection of the at least one protrusion structure does not overlap projection of the ceramic baseplate in a thickness direction of the chip. The chip, the ceramic baseplate, and the surface that is of the package baseplate and on which the at least one protrusion structure is disposed are disposed in the plastic package body.