公开(公告)号：US20250141345A1

公开(公告)日：2025-05-01

申请号：US19009701

申请日：2025-01-03

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Yao Chang ,  Jianrui Xue

IPC: H02M1/32 ,  B60L8/00 ,  G01K7/01 ,  H02M7/00 ,  H02M7/5387

Abstract: A power module includes a first power semiconductor chip, a first temperature sensor, a first diode chip, and a first circuit board. The first power semiconductor chip includes a first output electrode. The first temperature sensor is located inside the first power semiconductor chip, a first cathode of the first temperature sensor is electrically connected to the first output electrode. The first diode chip is electrically connected to the first power semiconductor chip, and a voltage is generated between the first output electrode and the first cathode when the first diode chip generates a reverse recovery current. The first circuit board is configured to obtain a first voltage difference between the first output electrode and the first cathode, to obtain a temperature of the first diode chip. The power module in this application can accurately and quickly detect temperatures of the first power semiconductor chip and the first diode chip.