Heat Sink and Power Conversion Device

    公开(公告)号:US20250008692A1

    公开(公告)日:2025-01-02

    申请号:US18884518

    申请日:2024-09-13

    Abstract: A power conversion device includes a housing with a mounting cavity, and the mounted cavity mounts a power element and a heat sink. The heat sink includes a thermally conductive plate which is mounted in the housing. The thermally conductive plate includes a first side in a first direction of the thermally conductive plate, where the first side has a heat source assembly region, and where the power element is disposed in the heat source assembly region and is in thermal contact with the thermally conductive plate. The thermally conductive plate has at least one sealed chamber, where the chamber is provided with flow channels that are spaced apart, and a two-phase cooling medium is accommodated in the flow channel. The flow channel includes a first end and a second end spaced apart in a third direction, and the first end is located above the second end.

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