公开(公告)号：US20220338369A1

公开(公告)日：2022-10-20

申请号：US17854210

申请日：2022-06-30

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Longhe WEI ,  Jun CHEN ,  Zhisheng LIAN ,  Quanming LI

IPC: H05K7/20

Abstract: The technology of this application relates to a heat dissipation apparatus applicable to a circuit board, where a plurality of heating elements are disposed on the circuit board. The heat dissipation apparatus includes a substrate, at least one heat conductor is disposed on one surface that is of the substrate and that faces the circuit board, one end of the heat conductor is connected to the substrate, and the other end extends toward the circuit board and is close to the heating elements. At least one heat conductor is disposed on the one surface that is of the substrate and that faces the circuit board, one end of the heat conductor is connected to the substrate, and the other end of the heat conductor extends toward the circuit board and is close to the heating elements.

公开(公告)号：US20240389283A1

公开(公告)日：2024-11-21

申请号：US18787644

申请日：2024-07-29

Applicant: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.

Inventor： Zhisheng LIAN ,  Longhe WEI

IPC: H05K7/20

Abstract: A heat dissipation system includes a heat dissipation cavity, a first liquid cooling assembly, an air cooling assembly, a first power cavity, and a first power device. The first liquid cooling assembly and the first power cavity are disposed inside the heat dissipation cavity. The first power device is disposed inside the first power cavity. The first power cavity is in contact with the first liquid cooling assembly. An air inlet and an air outlet of the air cooling assembly are disposed on the heat dissipation cavity. An air-cooled channel connected between the air inlet and the air outlet passes through the first liquid cooling assembly and/or the first power cavity. The first liquid cooling assembly and the air cooling assembly are configured to dissipate heat for the first power device.