公开(公告)号：US20240266980A1

公开(公告)日：2024-08-08

申请号：US18430324

申请日：2024-02-01

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Kang YU ,  Weilong ZHANG ,  Ming SUN

IPC: H02P27/06 ,  B60L15/00 ,  H05K7/20

CPC classification number: H02P27/06 ,  B60L15/007 ,  H05K7/209

Abstract: This application provides an inverter apparatus used in a motor controller, a motor controller, and a vehicle. The inverter apparatus includes a capacitor module, a power module, and a first heat sink. The power module includes a plurality of power transistors, and the plurality of power transistors are arranged in a flat manner in a direction perpendicular to a direction in which the power module and the first heat sink are stacked. The first heat sink is configured to dissipate heat for the power transistors in the power module, so that the power transistors operate in a proper temperature environment. The inverter apparatus provided in this application has a compact structure layout and high integration. This is conducive to implementing a miniaturization embodiment of the motor controller, and reducing difficulty of disassembling and assembling internal parts of the motor controller and costs.

公开(公告)号：US20250135901A1

公开(公告)日：2025-05-01

申请号：US18929868

申请日：2024-10-29

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Kang YU ,  Weilong ZHANG ,  Ziyou XU ,  Yankun XU ,  Jiasheng GAO ,  Chao FAN

IPC: B60L15/00 ,  B60L50/51 ,  B60L50/60 ,  B60L53/20

Abstract: This application relates to motor control unit technologies, and in particular, to a motor control unit, a powertrain, and a vehicle. The motor control unit includes a three-phase bridge arm, a capacitor module, and a heat dissipation panel group. The capacitor module includes a capacitor housing and a capacitor core package, and the capacitor housing includes a first sub-housing and a second sub-housing. A gap between the first sub-housing and the second sub-housing forms an accommodating cavity in a first direction, and the accommodating cavity is used to accommodate the capacitor core package. The three-phase bridge arm includes a plurality of power modules. The heat dissipation panel group is configured to dissipate heat for the plurality of power modules.