公开(公告)号：US20240072724A1

公开(公告)日：2024-02-29

申请号：US18455917

申请日：2023-08-25

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Zhiqiang XIANG ,  Jiebin CHENG

IPC: H02S40/42

CPC classification number: H02S40/425

Abstract: An electronic apparatus and a photovoltaic power optimizer. The electronic apparatus includes a circuit board, a heat dissipation housing, and an insulation member. The circuit board has a first surface and a second surface opposite to each other, where a first heat dissipation region is formed on the first surface and a second heat dissipation region is formed on the second surface. A first heat dissipation member has a first heat dissipation surface that is in direct contact with the first heat dissipation region. A second heat dissipation member is connected to the first heat dissipation member in a first direction, and has a second heat dissipation surface that is in direct contact with the second heat dissipation region. The first heat dissipation region and the second heat dissipation region are sealed by using the first heat dissipation member and the second heat dissipation member.

公开(公告)号：US20220256709A1

公开(公告)日：2022-08-11

申请号：US17669142

申请日：2022-02-10

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： Zhiqiang XIANG

IPC: H05K1/18

Abstract: Embodiments of this application disclose an electronic component package body, an electronic component assembly structure, and an electronic device. The electronic component assembly structure includes: an electronic component package body, where the electronic component package body includes a substrate, an electronic component, and a pin; the electronic component is packaged inside the substrate, and the pin is electrically connected to the electronic component; the pin includes a first part embedded in the substrate, and a second part protruding from the substrate; the second part includes a bottom surface and a side surface, the bottom surface is an outer surface that is of the pin and that is away from the substrate, and the side surface is connected between the bottom surface and the substrate. In this application, reliability of soldering between the electronic component package body and the circuit board is relatively high.