公开(公告)号：US20150305194A1

公开(公告)日：2015-10-22

申请号：US14788063

申请日：2015-06-30

Applicant: Huawei Technologies Co., Ltd.

Inventor： Nengwu XIANG ,  Changyi LIU

IPC: H05K7/20 ,  H05K7/14

CPC classification number: H05K7/20136 ,  H05K7/1439 ,  H05K7/1447 ,  H05K7/20572

Abstract: A heat dissipation system used for a communications device is disclosed, where the communications device includes a chassis, a network board, a service board, a backplane, and a high-rate cable; the chassis is configured to house the network board, the service board, the backplane, and the high-rate cable; the backplane is vertically inserted in a middle part or a middle rear part of the chassis, and parallel to a front side of the chassis; the service board and the network board are parallel and are connected to a front side of the backplane; the high-rate cable is connected between the network board and the service board on a rear side of the backplane; and the heat dissipation system further includes multiple fans that are installed in an array form on a rear side of the chassis, and an air vent that penetrates through the backplane.

Abstract translation: 公开了一种用于通信设备的散热系统，其中通信设备包括机箱，网络板，业务板，背板和高速率电缆; 机箱配置为容纳网板，业务板，背板和高速率电缆; 底板垂直插入底盘的中间部分或中后部，平行于机箱的前侧; 维修板和网板平行并连接到背板的正面; 高速率电缆连接在背板背面的网板与维修板之间; 并且散热系统还包括以阵列形式安装在底盘的后侧的多个风扇和穿过背板的排气口。