公开(公告)号：US12273958B2

公开(公告)日：2025-04-08

申请号：US17639191

申请日：2020-08-13

Applicant: Huawei Technologies Co., Ltd.

Inventor： Tao Li ,  Zezhi Wang ,  Chunlin Li ,  Xiao Han ,  Xin Zhang

IPC: H04W8/18 ,  H04W8/20 ,  H04W8/24 ,  H04W88/06

Abstract: Embodiments of this application provide a SIM module management method and an electronic device, and relate to the field of electronic devices. A solution that supports an eSIM module is provided for an existing electronic device that supports dual SIM modules, so that the dual SIM modules are compatible with the eSIM module. The electronic device in the embodiments of this application may support three SIM modules. The three SIM modules include at least one eSIM module. The remaining two SIM modules may be both plug-in SIM modules, or may be one plug-in SIM module and one softSlM module. A user can arbitrarily select two SIM modules from the three SIM modules to be in online standby mode, or can arbitrarily select one SIM module from the three SIM modules to be in online standby mode.