公开(公告)号：US20240251167A1

公开(公告)日：2024-07-25

申请号：US18562335

申请日：2022-05-13

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Cunying Li ,  Kun Ran ,  Shusheng Peng ,  Linghui Zeng ,  Lin Yang

IPC: H04N23/68 ,  G03B13/36 ,  H04N23/54

CPC classification number: H04N23/687 ,  G03B13/36 ,  H04N23/54

Abstract: A camera and an electronic device are provided to improve image stabilization. The camera provides an integrated circuit board that includes a fastening assembly and a movable assembly. The movable assembly includes an image sensor carrying assembly, one or more suspended beam assemblies, and one or more flexible assemblies. The image sensor carrying assembly is configured to carry an image sensor. The one or more suspended beam assemblies are configured to fasten a first magnetic driver group or a second magnetic driver group. The one or more suspended beam assemblies and the image sensor carrying assembly are connected to the fastening assembly through the one or more flexible assemblies. The entire circuit board is compact in structure, and the first magnetic driver group or the second magnetic driver group may be directly fastened to the circuit board to drive the image sensor.

公开(公告)号：US11102384B2

公开(公告)日：2021-08-24

申请号：US16331869

申请日：2017-01-13

Applicant: Huawei Technologies Co., Ltd.

Inventor： Guanghai Wang ,  Cunying Li ,  Zhendong Luo ,  Qingshan Tian ,  Jianwen Wang ,  Sheng Li

IPC: H04N5/225 ,  H05K3/30

Abstract: A camera substrate assembly, a camera apparatus, and a terminal device, where the camera substrate assembly includes a rigid support plate and a printed circuit board laminated, where at least two mounting holes for accommodating camera chips are disposed on the printed circuit board, the rigid support plate has mounting surfaces facing the mounting holes respectively and are configured to support the camera chips, strength of the rigid support plate is greater than strength of the printed circuit board, and flatness of the mounting surfaces is less than a specified threshold. The mounting holes disposed on the printed circuit board and the mounting surfaces disposed on the rigid support plate are used to support cameras. This avoids impact of warpage on camera mounting when the printed circuit board and a flexible circuit board are laminated, and improves flatness after camera mounting.

公开(公告)号：US20190356822A1

公开(公告)日：2019-11-21

申请号：US16331869

申请日：2017-01-13

Applicant: Huawei Technologies Co., Ltd.

Inventor： Guanghai Wang ,  Cunying Li ,  Zhendong Luo ,  Qingshan Tian ,  Jianwen Wang ,  Sheng Li

IPC: H04N5/225 ,  H05K3/30

Abstract: A camera substrate assembly, a camera apparatus, and a terminal device, where the camera substrate assembly includes a rigid support plate and a printed circuit board laminated, where at least two mounting holes for accommodating camera chips are disposed on the printed circuit board, the rigid support plate has mounting surfaces facing the mounting holes respectively and are configured to support the camera chips, strength of the rigid support plate is greater than strength of the printed circuit board, and flatness of the mounting surfaces is less than a specified threshold. The mounting holes disposed on the printed circuit board and the mounting surfaces disposed on the rigid support plate are used to support cameras. This avoids impact of warpage on camera mounting when the printed circuit board and a flexible circuit board are laminated, and improves flatness after camera mounting.