公开(公告)号：US11967778B2

公开(公告)日：2024-04-23

申请号：US17536332

申请日：2021-11-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Heng Qu ,  Meijuan Fu ,  Liguo Zhang ,  Ying Kang

IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q1/38

CPC classification number: H01Q9/0414 ,  H01Q1/243 ,  H01Q1/38

Abstract: This application provides a packaging structure, including an antenna in package and a radio frequency chip that are packaged together, where the antenna in package is fastened on the radio frequency chip. The antenna in package includes a radiator and at least two feeding parts, the at least two feeding parts are electrically connected to the radio frequency chip, the radio frequency chip is configured to receive or transmit a radio frequency signal, and at least one of the at least two feeding parts provides differential feeding for the radiator. This application further provides a network device and a terminal device, to reduce an antenna size and make the antenna easier to mount.

公开(公告)号：US11462817B2

公开(公告)日：2022-10-04

申请号：US17079997

申请日：2020-10-26

Applicant: Huawei Technologies Co., Ltd.

Inventor： Heng Qu ,  Ming Chang ,  Hailin Dong ,  Xinhong Li ,  Liangsheng Liu ,  Hongcheng Yin

IPC: H01Q1/22 ,  H01Q1/36 ,  H01Q13/10

Abstract: A packaging structure, where the packaging structure includes: a first radiation plate, a second radiation plate, and a feeding part, where the second radiation plate is disposed below the first radiation plate, where a slot is disposed on the second radiation plate, where the slot is in a ring shape, where the feeding part is disposed below the second radiation plate, and where the feeding part includes a first feeding stub and a second feeding stub that are disposed independently of each other. Additionally, the first feeding stub and the second feeding stub are perpendicular to each other and disposed on a substrate below the slot, and the first feeding stub and the second feeding stub feed the first radiation plate using the slot.

公开(公告)号：US20210043998A1

公开(公告)日：2021-02-11

申请号：US17079997

申请日：2020-10-26

Applicant: Huawei Technologies Co., Ltd.

Inventor： Heng Qu ,  Ming Chang ,  Hailin Dong ,  Xinhong Li ,  Liangsheng Liu ,  Hongcheng Yin

IPC: H01Q1/22 ,  H01Q13/10 ,  H01Q1/36

Abstract: A packaging structure, where the packaging structure includes: a first radiation plate, a second radiation plate, and a feeding part, where the second radiation plate is disposed below the first radiation plate, where a slot is disposed on the second radiation plate, where the slot is in a ring shape, where the feeding part is disposed below the second radiation plate, and where the feeding part includes a first feeding stub and a second feeding stub that are disposed independently of each other. Additionally, the first feeding stub and the second feeding stub are perpendicular to each other and disposed on a substrate below the slot, and the first feeding stub and the second feeding stub feed the first radiation plate using the slot.