公开(公告)号：US20230370024A1

公开(公告)日：2023-11-16

申请号：US18361461

申请日：2023-07-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hailei Suo ,  Liang Yi ,  Yijun Sun ,  Jie Sun

IPC: H03F1/42 ,  H03F1/56 ,  H03F3/21 ,  H03F1/32

CPC classification number: H03F1/42 ,  H03F1/3205 ,  H03F1/56 ,  H03F3/21 ,  H03F2200/387 ,  H03F2200/451

Abstract: Embodiments of this application provide a multiband power amplifier circuit and a radio frequency transceiver, to increase a VBW while ensuring linear correction and reducing a circuit loss. The multiband power amplifier circuit includes a first power transistor, a second power transistor, a first matching circuit, a second matching circuit, a third matching circuit, and a combiner. The first power transistor is coupled to a first input end of the combiner via the first matching circuit. The second power transistor is coupled to a second input end of the combiner via the second matching circuit. A first end of the third matching circuit is coupled to an output end of the first power transistor, and a second end of the third matching circuit is coupled to an output end of the second power transistor.