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公开(公告)号:US20230385112A1
公开(公告)日:2023-11-30
申请号:US18248073
申请日:2021-09-03
Applicant: Huawei Technologies Co., Ltd.
IPC: G06F9/50
CPC classification number: G06F9/5016 , G06F9/5022
Abstract: A memory management method includes: obtaining a resource requirement that a process in kernel space awaits; when detected that a first process is in a first state and meets a preset condition, changing the first process in the first state to a second state, and swapping out a memory resource of the first process; and when detected that a released system resource meets a resource requirement of the first process in the second state, changing a status of the first process, and swapping in a memory resource.
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公开(公告)号:US20230075194A1
公开(公告)日:2023-03-09
申请号:US17895507
申请日:2022-08-25
Applicant: Huawei Technologies Co., Ltd.
Abstract: A magnetic power component includes a printed circuit board and a magnetic core assembled to the printed circuit board. The magnetic core includes a magnetic core body and a plurality of heat dissipation teeth. The magnetic core body is bonded to the printed circuit board. The plurality of heat dissipation teeth is protruded from an outer surface that is of the magnetic core body and that faces away from the printed circuit board. The plurality of heat dissipation teeth and the magnetic core body are bonded through direct contact.
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