公开(公告)号：US20140098493A1

公开(公告)日：2014-04-10

申请号：US14102099

申请日：2013-12-10

Applicant: Huawei Technologies Co., Ltd.

Inventor： Gang Chen ,  Shoukai Zhang ,  Liwen Shu ,  Weidong Tang

IPC: H05K7/20

CPC classification number: H05K7/20127 ,  H05K7/20145 ,  H05K7/20563

Abstract: A heat dissipation system in a box type chassis of a communication device includes an upper heat dissipation channel and a lower heat dissipation channel, which both have an air exhaust vent and an air intake vent, the air intake vent and the air exhaust vent of the upper heat dissipation channel and the lower heat dissipation channel are defined on sidewalls of the box type chassis, and the air intake vent of the upper heat dissipation channel is located above the air exhaust vent of the lower heat dissipation channel. An air baffle is arranged in the box type chassis to generate a circulative airflow in the box type chassis, and therefore, heat dissipated by a circuit board is circulated in the box type chassis through the airflow, the temperature in the box type chassis reaches an extent that prevents vapor from condensing or even becoming a water film.

Abstract translation: 通信装置的盒式底盘中的散热系统包括上部散热通道和下部散热通道，其具有排气口和进气口，进气口和排气口 上部散热通道和下部散热通道限定在盒式底盘的侧壁上，上部散热通道的进气口位于下部散热通道的排气口上方。 在箱式底盘中设置有空气挡板，以在盒式底盘中产生循环气流，因此电路板散热通过气流在盒式底盘中循环，盒式底盘中的温度达到 防止蒸汽冷凝或甚至变成水膜的程度。

公开(公告)号：US09326419B2

公开(公告)日：2016-04-26

申请号：US14102099

申请日：2013-12-10

Applicant: Huawei Technologies Co., Ltd.

Inventor： Gang Chen ,  Shoukai Zhang ,  Liwen Shu ,  Weidong Tang

IPC: H05K7/20

CPC classification number: H05K7/20127 ,  H05K7/20145 ,  H05K7/20563

Abstract: A heat dissipation system in a box type chassis of a communication device includes an upper heat dissipation channel and a lower heat dissipation channel, which both have an air exhaust vent and an air intake vent, the air intake vent and the air exhaust vent of the upper heat dissipation channel and the lower heat dissipation channel are defined on sidewalls of the box type chassis, and the air intake vent of the upper heat dissipation channel is located above the air exhaust vent of the lower heat dissipation channel. An air baffle is arranged in the box type chassis to generate a circulative airflow in the box type chassis, and therefore, heat dissipated by a circuit board is circulated in the box type chassis through the airflow, the temperature in the box type chassis reaches an extent that prevents vapor from condensing or even becoming a water film.

Abstract translation: 通信装置的盒式底盘中的散热系统包括上部散热通道和下部散热通道，其具有排气口和进气口，进气口和排气口 上部散热通道和下部散热通道限定在盒式底盘的侧壁上，上部散热通道的进气口位于下部散热通道的排气口上方。 在箱式底盘中设置有空气挡板，以在盒式底盘中产生循环气流，因此电路板散热通过气流在盒式底盘中循环，盒式底盘中的温度达到 防止蒸汽冷凝或甚至变成水膜的程度。