公开(公告)号：US20230012986A1

公开(公告)日：2023-01-19

申请号：US17950610

申请日：2022-09-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Heng LI ,  Xiaodong ZHANG ,  Tonglong ZHANG ,  Simin WANG

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/48 ,  H01L23/00 ,  H01L21/56

Abstract: This disclosure provides a chip structure, including a first chip and a first protective layer, where the first protective layer covers a first surface of the first chip; and a first conductive connector is vertically disposed in the first protective layer, the first conductive connector penetrates through an upper surface and a lower surface of the first protective layer, one end of the first conductive connector is electrically connected to the first surface of the first chip, the other end of the first conductive connector is exposed to the first protective layer, and the first protective layer is formed by a material whose modulus is greater than a preset value.