公开(公告)号：US11641072B2

公开(公告)日：2023-05-02

申请号：US17327297

申请日：2021-05-21

Applicant: Huawei Technologies Co., Ltd.

Inventor： Weijian Pan ,  Zhixiang Hu ,  Dan Yang

IPC: H01R12/00 ,  H01R12/70 ,  H01R12/73 ,  H05K3/00 ,  H05K3/04

Abstract: This application relates to the field of power supply packaging technologies, and in particular, to a PCB-pinout based packaged module, including a packaged module and a pin exposed outside the packaged module. The packaged module includes a PCB and a power component. The PCB has a first surface and a second surface that are disposed opposite to each other, and the power component is disposed on the first surface or the second surface of the PCB. The power component performs communication connection with a pin located on one side of the first surface or one side of the second surface of the PCB through surface-layer copper of the PCB. The pin located on one side of the first surface or one side of the second surface of the PCB is a surface-layer copper etching pattern that is located on the PCB and that is exposed outside the packaged module.