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公开(公告)号:US20200273770A1
公开(公告)日:2020-08-27
申请号:US16757012
申请日:2017-10-20
Applicant: Huawei Technologies Co., Ltd.
Inventor: Jianping Fang , Yanqin Liao , Haohui Long , Hui Si
IPC: H01L23/31 , H01L23/498 , H01L23/00 , H01L21/56 , G06K9/00
Abstract: A chip package structure and a chip package method, the chip package structure including a die and a package substrate disposed around the die. A solder joint is disposed on a first surface of the die. Remaining surfaces of the die other than a second surface are wrapped by an injection molding material. At least one pair of opposite sides of the package substrate is embedded in the injection molding material. A contact area between the pair of opposite sides and the injection molding material accounts for more than half of a surface area of the pair of opposite sides. The second surface is a surface that is of the die and that is opposite to the first surface.
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公开(公告)号:US11309227B2
公开(公告)日:2022-04-19
申请号:US16757012
申请日:2017-10-20
Applicant: Huawei Technologies Co., Ltd.
Inventor: Jianping Fang , Yanqin Liao , Haohui Long , Hui Si
IPC: H01L23/31 , G06K9/00 , H01L21/56 , H01L23/498 , H01L23/00
Abstract: A chip package structure and a chip package method, the chip package structure including a die and a package substrate disposed around the die. A solder joint is disposed on a first surface of the die. Remaining surfaces of the die other than a second surface are wrapped by an injection molding material. At least one pair of opposite sides of the package substrate is embedded in the injection molding material. A contact area between the pair of opposite sides and the injection molding material accounts for more than half of a surface area of the pair of opposite sides. The second surface is a surface that is of the die and that is opposite to the first surface.
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