公开(公告)号：US20200273770A1

公开(公告)日：2020-08-27

申请号：US16757012

申请日：2017-10-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jianping Fang ,  Yanqin Liao ,  Haohui Long ,  Hui Si

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  G06K9/00

Abstract: A chip package structure and a chip package method, the chip package structure including a die and a package substrate disposed around the die. A solder joint is disposed on a first surface of the die. Remaining surfaces of the die other than a second surface are wrapped by an injection molding material. At least one pair of opposite sides of the package substrate is embedded in the injection molding material. A contact area between the pair of opposite sides and the injection molding material accounts for more than half of a surface area of the pair of opposite sides. The second surface is a surface that is of the die and that is opposite to the first surface.

公开(公告)号：US11309227B2

公开(公告)日：2022-04-19

申请号：US16757012

申请日：2017-10-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jianping Fang ,  Yanqin Liao ,  Haohui Long ,  Hui Si

IPC: H01L23/31 ,  G06K9/00 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00

Abstract: A chip package structure and a chip package method, the chip package structure including a die and a package substrate disposed around the die. A solder joint is disposed on a first surface of the die. Remaining surfaces of the die other than a second surface are wrapped by an injection molding material. At least one pair of opposite sides of the package substrate is embedded in the injection molding material. A contact area between the pair of opposite sides and the injection molding material accounts for more than half of a surface area of the pair of opposite sides. The second surface is a surface that is of the die and that is opposite to the first surface.