公开(公告)号：US20170352949A1

公开(公告)日：2017-12-07

申请号：US15538837

申请日：2014-12-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Chen ZHANG ,  Jianming GAO ,  Yibo CHEN ,  Bing LIU

IPC: H01Q1/38 ,  H01Q1/22 ,  H01Q1/24 ,  H05K7/14

CPC classification number: H01Q1/38 ,  H01Q1/22 ,  H01Q1/243 ,  H01Q5/335 ,  H01Q7/00 ,  H05K7/1428 ,  H05K7/1438

Abstract: Embodiments of the present disclosure disclose an antenna, and relate to the field of wireless communications. In the antenna, radiation parts of the antenna are disposed on at least two layers of circuit boards on a printed circuit board: a top layer circuit board and a first layer circuit board, so that lengths of the radiation parts of the antenna are reduced, and space occupied by a printed wire of the antenna on the PCB is reduced. Therefore, reducing a PCB size becomes possible, a size of a terminal using the reduced-size PCB may also be correspondingly reduced, and the terminal may be further miniaturized.