公开(公告)号：US20250157945A1

公开(公告)日：2025-05-15

申请号：US19024776

申请日：2025-01-16

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xuan Wang ,  Po Shi ,  Zhengde Yang ,  Yongsheng Li

IPC: H01L23/552 ,  H01L21/56 ,  H01L21/77 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/16 ,  H10B80/00 ,  H10D80/30

Abstract: A chip package structure includes a substrate, a chip, and a shielding layer. The substrate includes a plurality of stacked metal layers. A first conductive column runs through at least two metal layers, and has a first contact surface that is exposed to an outer side of the substrate and that faces a top surface of the substrate. The chip is disposed on the top surface of the substrate. The shielding layer is formed outside the chip, and is connected to the first conductive column through the first contact surface, and the shielding layer is grounded. In the chip package structure, the shielding layer is connected to the first conductive column through contact with the first contact surface, and is grounded to form an electromagnetic shielding cavity.