公开(公告)号：US12061369B2

公开(公告)日：2024-08-13

申请号：US17813874

申请日：2022-07-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Yunchao Han ,  Dongjie Ai ,  Jing Wang

IPC: G02B6/42

CPC classification number: G02B6/4272 ,  G02B6/4269 ,  G02B6/428

Abstract: This application provides a heat dissipation structure for an optical module and a communications device, and relates to the field of optical communications technologies. The heat dissipation structure for the optical module includes: a panel with a jack; a PCB board, disposed on one side of the panel, where the PCB board is configured to install the optical module; and a heat conduction module, configured to conduct, to the panel, heat emitted from the optical module, where one end of the heat conduction module is in contact with the optical module, and the other end of the heat conduction module is in contact with the panel. In the heat dissipation structure for the optical module and the communications device, the panel is mainly used to dissipate heat from the optical module.