公开(公告)号：US12149002B2

公开(公告)日：2024-11-19

申请号：US17617586

申请日：2019-12-19

Applicant: HuiZhou TCL Mobile Communication Co., Ltd.

Inventor： Wei Chen ,  Song Bai ,  Zhiwei Chen

IPC: H01Q21/30 ,  H01Q1/24

Abstract: An antenna array, comprising: an antenna feed point, a first antenna wiring, a second antenna wiring and a filter, wherein the first antenna wiring is connected to the second antenna wiring by means of the filter; the antenna feed point is connected to the first antenna wiring; the filter is located within a predetermined range from the antenna feed point; the working frequency band of the first antenna wiring is a first frequency band; the working frequency band of the second antenna wiring is a second frequency band; and the filter is used for filtering out a third frequency band from the first frequency band, such that the second frequency band passes.

公开(公告)号：US12150241B2

公开(公告)日：2024-11-19

申请号：US17615843

申请日：2019-12-18

Applicant: HuiZhou TCL Mobile Communication Co., Ltd.

Inventor： Wei Chen ,  Junsheng Hou ,  Song Bai

IPC: H01Q5/50 ,  H01P5/16 ,  H03H7/38 ,  H04B1/18 ,  H05K1/02

Abstract: Disclosed is an antenna impedance matching circuit, an antenna system, a printed circuit board, and a terminal. The antenna impedance matching circuit comprises: a first transmission line having a first specific length such that the first transmission line is capacitive, and a second transmission line having a second specific length such that the second transmission line is inductive. In particular, the first transmission line and the second transmission line are connected in parallel, and terminals of the first transmission line and the second transmission line are open or shorted.

公开(公告)号：US20230089152A1

公开(公告)日：2023-03-23

申请号：US17758009

申请日：2020-02-21

Applicant: HUIZHOU TCL MOBILE COMMUNICATION CO., LTD

Inventor： Wei Chen ,  Song Bai ,  Weidong Luo

IPC: H05K9/00

Abstract: A conductive foam includes a foam body, a conductive cloth, and a conductive adhesive layer. The conductive cloth wraps an outer surface of the foam body and includes a device contact surface configured to contact an external device for assembly. The conductive adhesive layer is disposed on the device contact surface.