专利检索 ap:("Hyundai Motor Company" OR "Kia Motors Corporation") AND inv:"Myung You, III" 第 1 页

1.

发明申请
METHOD AND STRUCTURE TO CONTROL THE SOLDER THICKNESS FOR DOUBLE SIDED COOLING POWER MODULE 有权

公开(公告)号：US20210327842A1

公开(公告)日：2021-10-21

申请号：US17035430

申请日：2020-09-28

申请人： Hyundai Motor Company , Kia Motors Corporation

发明人： Tae Hwa KIM , Myung You, III

IPC分类号： H01L23/00 , H01L23/367

摘要： In a soldering structure, a power module having the same, and a method for manufacturing the power module configured for constantly determining a height of a power module when the power module is manufactured, the soldering structure may include a soldering target portion; a metal layer including a bonding surface having a bonding region in which the soldering target portion is bonded by solder; and at least one wire located in the solder within the bonding region.