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公开(公告)号：US11355688B2
公开(公告)日：2022-06-07
申请号：US15959182
申请日：2018-04-21
发明人： Jin Woo Kwak , Byung Wook Kim , Kyong Hwa Song , Byung Jin Hwang , Byeong Hoon Yeon , Kyoung Hyun Son , Jong Bae Kim , Seung Ho Yang , Jae Soung Park
摘要： A thermoelectric module includes: an electrode; a double layer stacked on a thermoelectric pellet; and a solder layer interposed between the double layer and the electrode to bond the double layer to the electrode, the solder layer containing a Sn—Cu-based alloy. The solder layer is formed to have an interface with one of the double layer and the electrode and has at least one ε layer having an ε phase (Cu3Sn).
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公开(公告)号：US20190189887A1
公开(公告)日：2019-06-20
申请号：US15959182
申请日：2018-04-21
发明人： Jin Woo Kwak , Byung Wook Kim , Kyong Hwa Song , Byung Jin Hwang , Byeong Hoon Yeon , Kyoung Hyun Son , Jong Bae Kim , Seung Ho Yang , Jae Soung Park
摘要： A thermoelectric module includes: an electrode; a double layer stacked on a thermoelectric pellet; and a solder layer interposed between the double layer and the electrode to bond the double layer to the electrode, the solder layer containing a Sn—Cu-based alloy. The solder layer is formed to have an interface with one of the double layer and the electrode and has at least one ε layer having an ε phase (Cu3Sn).
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公开(公告)号：US20230019266A1
公开(公告)日：2023-01-19
申请号：US17584146
申请日：2022-01-25
发明人： Byung Wook Kim , Min Jae Lee , Byung Jin Hwang , Seung Jin Yang , Byeong Hoon Yeon , Kyoung Hyun Son , Bong Jung Jang , Tae Hee Lee , Seung Ho Yang , Joo Hyeon Park , Jung Ku Park
摘要： A thermoelectric module includes a first electrode, a first oxidation preventing layer, a plurality of first bonding layers containing silver (Ag), a second oxidation preventing layer, a first plating layer, a thermoelectric element, a second plating layer, a third oxidation preventing layer, a second bonding layer containing silver (Ag), a fourth oxidation preventing layer, and a second electrode.
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