公开(公告)号：US06909825B2

公开(公告)日：2005-06-21

申请号：US10620204

申请日：2003-07-15

申请人： Hyung Man Lee ,  Young Min Im ,  Myung Jin Kim ,  Hwe Kyung Kim ,  Young Il Kim

发明人： Hyung Man Lee ,  Young Min Im ,  Myung Jin Kim ,  Hwe Kyung Kim ,  Young Il Kim

IPC分类号： G02B6/42 ,  G02B6/32 ,  G02B6/34 ,  G02B8/32

CPC分类号： G02B6/2937 ,  G02B6/29398 ,  G02B6/327

摘要： The present invention relates to a method of packaging optical parts for optical communication. According to the method of the present invention, there are advantages in that a packaging process for optical parts is automated to improve productivity and to obtain price competitiveness and uniformity of quality, and a high frequency heater for locally transferring heat to only a solder preform is used to minimize thermal deformation of areas except a soldering area, thereby achieving highly reliable packaging of the optical parts.

摘要翻译： 本发明涉及一种用于光通信的光学部件的封装方法。 根据本发明的方法，具有以下优点：光学部件的包装过程是自动化的，以提高生产率并获得价格竞争力和质量均匀性，并且仅将热量局部转移到仅仅焊料预制件的高频加热器是 用于使焊接区域以外的区域的热变形最小化，从而实现光学部件的高度可靠的封装。