公开(公告)号：US3640738A

公开(公告)日：1972-02-08

申请号：US3640738D

申请日：1970-11-20

Applicant: IBM

Inventor： DETWEILER JOHN R JR ,  TUMMALA RAO R

IPC: C03C3/093 ,  C03C3/04

CPC classification number: C03C3/093

Abstract: A glass composition particularly adapted for use with ceramic materials in electronic module applications having a thermal coefficient of expansion substantially matching the thermal coefficient of expansion of ceramic material, and a low dielectric constant less than 4.5. The composition is a borosilicate glass consisting essentially of SiO2, B2O3, CaO, A12O3, Na2O, K2O, BaO, ZrO2, and MgO in relatively precise amounts.

Abstract translation: 特别适用于具有基本上与陶瓷材料的热膨胀系数匹配的热膨胀系数和小于4.5的低介电常数的电子模块应用中的陶瓷材料的玻璃组合物。 该组合物是基本上由相对精确量的SiO 2，B 2 O 3，CaO，Al 2 O 3，Na 2 O，K 2 O，BaO，ZrO 2和MgO组成的硼硅酸盐玻璃。