公开(公告)号：US20190320504A1

公开(公告)日：2019-10-17

申请号：US15995903

申请日：2018-06-01

Applicant: IM CO., LTD.

Inventor： Ji Hun PARK ,  Seung Yeon LEE ,  Seong Hwan LIM ,  Yeo Jo YOON ,  Hye Jin KIM

IPC: H05B3/86 ,  H04N5/225 ,  H05B3/14 ,  H05B3/16

Abstract: Disclosed is a heating device, including a substrate, a metal oxide layer formed on the substrate, hyper heat accelerator dots having a spherical shape formed on the metal oxide layer and arranged in a lattice form, and a conductive adhesive layer formed on the metal oxide layer and the hyper heat accelerator dots, wherein the lower portions of the hyper heat accelerator dots having a spherical shape are included in the metal oxide layer and the upper portions thereof are included in the conductive adhesive layer.