公开(公告)号：US20230270020A1

公开(公告)日：2023-08-24

申请号：US18055961

申请日：2022-11-16

申请人： IMEC VZW

发明人： Vadiraj Manjunath Ananthapadmanabha Rao ,  Steven Van Winckel ,  Steven Brebels

IPC分类号： H10N60/81

CPC分类号： H10N60/81

摘要： A package includes a metal plate and a carrier substrate mounted on the top surface thereof, which includes one or more superconducting chips mounted on the carrier substrate or configured to receive the one or more chips mounted thereon. The carrier substrate and the plate are sandwiched between the planar portions of a first and second magnetic shield structure, at least the first structure including a planar portion and a receptacle-shaped shell portion arranged above and around the chip location. The package includes one or more pillars formed of a magnetic shielding material which are clamped between the planar portions of the shield structures, wherein the one or more pillars are penetrating the carrier substrate and the metal support plate, and wherein the one or more pillars are in physical contact with both of the planar portions.