Apparatus, systems, and methods for machining material

    公开(公告)号:US12103194B2

    公开(公告)日:2024-10-01

    申请号:US17396950

    申请日:2021-08-09

    CPC classification number: B27F1/02

    Abstract: A device for machining material includes a rotatable turret including a plurality of plank holding positions, each plank holding position including a plank holding device. A projector is configured to project at least one cut line on a first surface of a plank. A cutting device is positioned adjacent to the turret, the cutting device includes a cutting tool configured to cut a trim section along a second surface of the plank to establish a substantially planar portion and/or to locate defects of the first edge. A sensor is configured to scan the first edge of the plank and determine whether the groove and the substantially planar portion are within a predetermined tolerance. A jointing device is positioned adjacent to the turret, the jointing device includes a joint cutting tool configured to cut at least one groove on the second surface.

Patent Agency Ranking