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公开(公告)号:US11136237B2
公开(公告)日:2021-10-05
申请号:US16581997
申请日:2019-09-25
Applicant: INFINEON TECHNOLOGIES AG
Inventor: Werner Simbuerger , Eduardo Schittler Neves , Andreas Wiesbauer
Abstract: A device for suppressing stray radiation includes a Micro-ElectroMechanical System (MEMS) sensor module and a conductive cage structure. The conductive cage structure may enclose the MEMS sensor module in order to suppress penetration of stray electromagnetic radiation with a stray wavelength λo into the conductive cage structure, and the conductive cage structure may be arranged to be thermally insulated from the MEMS sensor module. The device may also include a connecting line. The connecting line may be connected to the MEMS sensor module and fed through the conductive cage structure by a capacitive element.
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公开(公告)号:US11322461B2
公开(公告)日:2022-05-03
申请号:US16992874
申请日:2020-08-13
Applicant: Infineon Technologies AG
Inventor: Eduardo Schittler Neves , Dan Horia Popescu
IPC: H01L23/64 , H01L23/495 , H01L21/56 , H01L23/00 , H01L23/31
Abstract: A package is disclosed. In one example the package comprises a carrier having a plurality of leads and an electronic component mounted on the carrier and comprising at least one pad. An impedance structure electrically couples the at least one pad with the carrier so that, at different ones of the leads, different impedance values of the impedance structure can be tapped.
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公开(公告)号:US20210050311A1
公开(公告)日:2021-02-18
申请号:US16992874
申请日:2020-08-13
Applicant: Infineon Technologies AG
Inventor: Eduardo Schittler Neves , Dan Horia Popescu
IPC: H01L23/64 , H01L23/495 , H01L21/56 , H01L23/00
Abstract: A package is disclosed. In one example the package comprises a carrier having a plurality of leads and an electronic component mounted on the carrier and comprising at least one pad. An impedance structure electrically couples the at least one pad with the carrier so that, at different ones of the leads, different impedance values of the impedance structure can be tapped.
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